Sillicon Photonics & Photonics Packaging

As AI clusters and hyperscale data centers demand higher bandwidth, lower power consumption, and greater interconnect density, Silicon Photonics (SiPh) and advanced photonic packaging are becoming critical to next-generation 800G, 1.6T, and 3.2T optical interconnects. Co-Packaged Optics (CPO), Near-Packaged Optics (NPO), Linear-drive Pluggable Optics (LPO), and Optical I/O bring optical connectivity closer to switch ASICs and GPUs. In all of these architectures, efficient and scalable optical coupling is one of the key challenges.

With NanoScribe, SuperbIN offers two-photon polymerization (2PP) 3D microfabrication for printing customized micro-optical components directly on photonic chips, wafers, optical fibers, and Fiber Array Units (FAU). Freeform lenses, TIR mirrors, and optical interposers can be printed in situ and aligned to existing structures. They can be optimized for different fiber numerical apertures (NA), wavelengths, and mode-field diameters, improving coupling efficiency, relaxing alignment tolerances, and compensating for bonding misalignment. The technology supports rapid prototyping and the transition toward production. Our Silicon Photonics and CPO Technical White Paper covers these approaches in detail.