Laser Processing Machine
SuperbIN’s Equipment Integration Division specializes in ultrafast laser precision micromachining systems. Our own application laboratory and optical process R&D team support the semiconductor, display, electronic component and biomedical industries, turning demanding process requirements into reliable, production-ready solutions.
All systems are assembled in Taiwan. Our in-house teams cover optics, motion and mechanical design, electrical control and software, so we can deliver highly customized equipment and respond quickly to customer needs. Our systems are already in use at many leading manufacturers in Taiwan, and we deliver at every stage of development: flexible R&D systems for process exploration, multi-function production machines that combine several processes, and fully automated systems for high-volume manufacturing. Our equipment also supports semiconductor factory automation standards, including SECS/GEM.
Process Development & Sample Testing
Our application laboratory offers customized sample testing on a wide range of materials, including tempered glass, ceramics, sapphire, quartz, PI and PET. We can evaluate drilling, cutting, scribing, engraving and marking to customer requirements, and help verify process feasibility and quality before equipment investment.
Sample testing is available for advanced applications such as Through Glass Via (TGV) drilling and Micro LED laser mass transfer. For emerging technologies, including direct laser writing of waveguides inside glass and precision diamond machining for semiconductor CMP pad conditioners, we also accept contract development projects to build the process together with our customers.
Key Features
Ultrafast laser technology for high-precision, low-thermal-damage micromachining
In-house optics, mechanical, electrical control and software engineering
Highly customized system design, assembled in Taiwan
From flexible R&D systems to fully automated mass-production lines
Multi-process integration in a single platform
SECS/GEM support for semiconductor factory integration
Application lab for sample testing, process development and contract development
Proven track record with leading manufacturers in Taiwan
Local technical support and fast service response
Applications
Advanced Processes – Sample Testing Available
Through Glass Via (TGV) drilling for glass core substrates and advanced packaging
Micro LED laser mass transfer
Contract Development
Direct laser writing of optical waveguides inside glass
Precision diamond machining for semiconductor CMP pad conditioners
Established Applications
Display panel and glass processing
Electronic components and flexible circuits (PI, PET)
Hard and brittle materials: sapphire, quartz, ceramics, tempered glass
Biomedical device micromachining
Precision drilling, cutting, scribing, engraving and marking
Process development and pilot production
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