FAMous-Through glass vias Machine
Through glass vias (TGV)
The trend towards smaller, more versatile, and interconnected devices like smartphones, wearables, and IoT gadgets is rapidly expanding. Meeting the demand for compactness and functionality requires advanced interconnection technologies capable of handling high density and bandwidth. 2.5D and 3D IC integration in packaging play a crucial role in meeting these next-generation performance needs and enabling their application in consumer products. Interposers are instrumental in facilitating a vast number of I/O connections, supporting these advancements
FAMous is designed to provide micromachined films fabrication with an excellent quality and a high throughput, which can be applied to the solution of the flexible panel processing. According to customers' requests, generally, the machining quality, including the cutting width, crater, burr and HAZ, will be the dominant factor for the product processings.
Furthermore, the takt time is definitely a crucial criterion for a laser processing machine.
Laser Through Glass Vias Features
Achieving taper angles as low as 1 degree
Minimizing process durations significantly
Enabling high aspect ratio vias.
Possible Machined Materials
Corning EXG
Schott BF33
Asahi AGC
Any glass with thickness smaller than 0.05 mm is also possible
Related Applications
Thin-film panel cutting.
PI substrate lift-off from glass (Laser Lift-Off, LLO).
Glass cutting (breaking) without damages of bottom film and/or metal circuit.
Film half-cutting without damages of bottom film and/or metal circuit.
Periodic microstructure
Direct laser engraving of flexographic plates and cylinders
Sub-surface laser engraving (SSLE)8. Direct photopolymer laser imaging
Product Gallery
Performances
| Model | FAMous TGV System |
|---|---|
| Takt Time | > 1000 holes /s |
| Thickness | < 1100 μm |
| hole size | ≥ 20 μm |
| Taper | < 1° |
| Machine accuracy | < 5 μm |
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