Laser Micro Marking Features
Industry standard SEMI OCR font (SEMI M12/M13)
Supported datamatrix marking
Down to 100 um marking pattern size
Minimum material removal and damage
Possible Machined Materials
Polyimide (PI)
Polyester (PET)
Metal Foil
Organic Film
Polymethyl Methacrylate (PMMA)
Liquid Crystal Polymer (LCP)
Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
Coverlay (Polyimide + Adhesive)
Copper-clad polyimide laminates with adhesive
Any material with thickness smaller than 0.5 mm is also possible
Related Applications
Thin-film panel cutting.
PI substrate lift-off from glass (Laser Lift-Off, LLO).
Glass cutting (breaking) without damages of bottom film and/or metal circuit.
Film half-cutting without damages of bottom film and/or metal circuit.
Periodic microstructure
Direct laser engraving of flexographic plates and cylinders
Sub-surface laser engraving (SSLE)8. Direct photopolymer laser imaging
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