Features
Up to 5 W at 1064 nm
Optional 532 nm and 355 nm wavelengths (could be all 3 electronically switchable wavelengths)
Up to 1 MHz repetition rate
Short pulse duration 10 ps
Up to 30 µJ pulse energy
Excellent beam quality M² < 1.3
Air cooled
Versatile laser control and synchronisation capabilities
Burst mode
Smart triggering for synchronous operation with polygon scanner and PSO
Compact, sealed and rugged design
Low cost of ownership
Possible Machined Materials
Various metals
Silicon
PET, PP, PI
Silicone
PCB
Solar cells
Brittle materials, including glass, ceramics, sapphire and PCD
Applications
Black marking, diffraction grating marking
Patterning
Micromachining
Solar cells CIGS scribing
PCB drilling and tracing
Drilling / Cutting
Structuring
Ablation / Dicing
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